Recently, the company completed the optimization and upgrade of the full-process testing system for PCBA production. By adding testing equipment, refining control nodes, and improving traceability mechanisms, we further enhanced product quality stability to meet customer requirements for high-reliability orders.

This optimization focuses on three key stages. In incoming material inspection, we added X-ray equipment for internal component defect detection and high-precision pad plating thickness testers. These tools conduct 100% sampling checks on the batch consistency, appearance, and electrical performance of core components, identifying incoming defects early and reducing quality risks during production.

For in-process testing, we upgraded the AOI automated optical inspection system with 3D solder joint scanning functionality. This enables precise detection of minor issues such as cold solder joints, solder balls, and component offset, achieving 100% inspection coverage. We also optimized the in-circuit testing (ICT) programs by adding automatic electrical parameter comparison for key nodes, allowing quick identification of circuit continuity abnormalities.

In final product testing, we improved aging and environmental simulation testing procedures. For automotive and industrial control orders, we added high-low temperature cycling, humidity simulation, and vibration testing to verify product performance stability under different working conditions. At the same time, we integrated testing data from all stages to enable full-process traceability from materials to finished products. Each PCBA can be traced through its batch number to view complete testing records, facilitating customer verification and after-sales analysis.