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Industry NewsNews > Industry News > HDI Technology Helps PCBAs Upgrade Consumer Electronics Performance    

HDI Technology Helps PCBAs Upgrade Consumer Electronics Performance

Hits:1  Add Date:2025/10/23

Asconsumer electronics pursue thinner, lighter, and higher-performance designs,high-density interconnect (HDI) technology, with its advantages of high circuitdensity and excellent signal integrity, is pushing PCBAs (Printed Circuit BoardAssemblies) beyond traditional design limitations, becoming a key hardwareenabler for consumer electronics performance upgrades.

Traditionalconsumer electronics PCBAs are limited by circuit layout, making it difficultto accommodate high-performance components within a small footprint. HDItechnology, through buried vias and arbitrary-layer interconnects, increasescomponent integration by 50% within the same PCBA footprint while optimizinghigh-speed signal transmission paths. For example, in high-end tablets,HDI-based PCBAs can integrate high-performance processors and large memorychips, while increasing signal transmission speeds by 30% and enabling smoothmulti-tasking. In ultrathin notebooks, HDI technology reduces PCBA thickness by25%, helping devices exceed 10mm in thickness. Furthermore, through excellentthermal management, the PCBA's operating temperature is kept below 55°C,preventing high temperatures from impacting device performance. Currently,HDI-PCBAs have become standard for mid- to high-end consumer electronics. Forexample, a certain brand's foldable phone features an 8-layer HDI design,seamlessly integrating flexible circuits and rigid components in the foldingarea. This ensures folding reliability (enduring 200,000 folds) while alsointegrating 5G communications and high-definition display driver modules.Smartwatches utilize HDI technology to integrate a heart rate sensor, GPSmodule, and charging circuitry onto a 20mm diameter circular board, extendingdevice battery life to 14 days and meeting user demands for extended batterylife.

 

Inthe future, as consumer electronics evolve toward multi-form and highlyinteractive devices, HDI technology will be deeply integrated with rigid-flexboards to create flexible, ultra-thin HDI-PCBAs suitable for new device formfactors, such as foldable and rollable devices. Furthermore, HDI boards willfurther optimize signal shielding design and enhance the PCBA'santi-interference capabilities, providing hardware support for the continuedperformance upgrade of consumer electronics.

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