<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">The main reason for PCBA solder joint failure:
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">
<span style="text-transform: none; letter-spacing: 0pt; font-family: 宋体; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-font-kerning: 0.0000pt; mso-bidi-font-family: Arial; mso-ascii-font-family: Arial; mso-hansi-font-family: Arial;">1, b<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">ad parts and components: plating, pollution, oxidation, coplanar;
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">2, bad PCB pad: coating, pollution, oxidation, warping;
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">3, solder quality defects: composition, impurities exceeded, oxidation;
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">4, flux quality defects: low flux, high corrosion, low SIR;
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">5, process parameter control defects: design, control, equipment;
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">6, other auxiliary material defects: adhesives, cleaning agents.
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">PCBA solder joint reliability improvement method:
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">The reliability experiment of PCBA solder joints, including reliability experiments and analysis, aims to evaluate and identify the reliability of PCBA integrated circuit devices and provide parameters for the reliability design of the whole machine.
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">
<span style="text-transform: none; letter-spacing: 0pt; font-family: Arial; font-size: 10.5pt; font-style: normal; mso-spacerun: "yes"; mso-fareast-font-family: 宋体; mso-font-kerning: 0.0000pt;">On the other hand, it is to Improve the reliability of solder joints during PCBA processing. This requires the necessary analysis of failed products to identify the failure mode and analyze the cause of failure. The purpose is to correct and improve the design process, structural parameters, welding process and improve the yield of PCBA processing. PCBA solder joint failure mode The prediction of cycle life is very important and is the basis for establishing its mathematical model.