During the soldering process of the PCBA circuit board, BGA solder balls are more or less likely to appear some bubbles, also known as tin ball holes. The industry has clear technical indicators for the size of the solder balls to ensure that the products are in the process of later use. Reduce the probability of occurrence of instability. PCB (Printed Circuit Board), printed circuit board, also known as printed circuit board, printed circuit board, is the most important electronic component, is the support of electronic components, is the provider of electrical connections of electronic components. At present, basically all electronic products have PCB carrier boards. Since it was made by electronic printing in the early days, it is called "printing" circuit board, and PCBA is the abbreviation of English Printed Circuit Board + Assembly, that is to say, The PCB blank board passes through the SMT upper part and passes through the entire process of the DIP plug-in, referred to as PCBA. After the PCBA passes the SMT upper part, if there is air bubble in the soldering of the solder ball, it will greatly discount the later use of the product, especially the instability, which is particularly noticeable.
  There are bubbles in the solder ball, which generally affects the electronic product in the later use process, and the electronic product is prone to heat, which is very likely to cause product instability. In the past, the specific standards in the industry are as follows: general consumer electronics BGA bubble diameter should not be greater than 60% or area should not be greater than 36%; commercial industrial electronic products BGA bubble diameter should not be greater than 42% or area should not be greater than 20.25%; military medical sector requirements are even more Strict, BGA bubble diameter should not be greater than 30% or the area is not more than 9%.
  At present, the industry has redefined the new BGA bubble standard, and the diameter of the bubble welding of non-industrial medical products is not more than 25% or the area is less than 20.25%. PCBA welding bubble volume needs to be tested by related equipment, such as X-RAY testing equipment, its powerful penetrating power, can penetrate the sample, directly detect the internal structure of the product, and can automatically measure the bubble area size and functionality.