Recently, the continuous breakthroughs of System-in-Package (SiP) technology in core areas such as high-density integration and heterogeneous chip compatibility, coupled with the large-scale application demands from end markets including consumer electronics and automotive electronics, are strongly driving the PCBA industry to accelerate its iterative upgrade towards high density, miniaturization, and low power consumption. It has become a core engine powering the high-quality development of China's electronic manufacturing industry. According to authoritative industry research reports, the overall market size of China's SiP is expected to reach 58 billion yuan by 2025, with a compound annual growth rate (CAGR) maintaining a high level of 18.5%. Among them, the relevant applications in the PCBA field account for more than 60%, making it the main pillar of SiP market growth.
As one of the core routes of advanced packaging technology, SiP technology efficiently integrates multiple types of chips (such as processors, memories, radio frequency chips, and sensors) and passive components (such as resistors and capacitors) into a single package through precise packaging design. This fundamentally optimizes the circuit layout of PCBA, significantly improving integration density and space utilization. Compared with traditional discrete component assembly solutions, the wiring density of SiP-integrated PCBA can be increased by more than 3 times, the minimum aperture can be accurately reduced to 0.1mm, and the line width only needs 0.12mm. This technical advantage can effectively reduce the volume of terminal products by 35%-50%, while significantly reducing signal transmission loss by more than 50%, effectively avoiding signal interference issues. It accurately meets the stringent application requirements of high-end fields such as 5G communication terminals, smart wearable devices, automotive intelligent cockpits, and industrial IoT sensors.
Senior industry experts stated that with the in-depth integration and application of advanced PCB manufacturing processes such as mSAP (Modified Semi-Additive Process) and low dielectric loss materials, the application cost of SiP technology in the PCBA field will be further reduced, and the application scenarios will continue to expand. This will accelerate the localization replacement process of the PCBA industry. It is expected that by 2030, the market size of domestic SiP-related PCBA will exceed 100 billion yuan, driving China's electronic manufacturing industry to completely break away from the traditional extensive development model and enter a new stage of high-quality development characterized by high reliability, high integration, and high added value.
