With the explosive growth of AI, 5G communications, and new energy vehicle industries, technological innovation in PCB, the "backbone" of electronic devices, has accelerated. Demand for high-end PCBs in China is growing significantly, and Laser Direct Imaging (LDI) and ALIVH Any-Layer Interconnection Technology have emerged as core forces reshaping the industry landscape, thanks to their advantages in high density and precision.

High-End Demand Drives Technological Upgrade

China's PCB industry has shifted from scale expansion to value leapfrogging. The PCB value per AI server reaches 5,000 yuan (three times that of traditional servers), while the PCB value for L4-level autonomous vehicles exceeds 2,000 yuan, with the per-vehicle usage increasing fivefold compared to traditional cars. The stringent requirements of "finer circuits, smaller apertures, and higher interlayer connection density" have rendered traditional processes obsolete, creating opportunities for advanced technologies to thrive.

Laser Imaging Technology Breaks Through Process Bottlenecks

Abandoning traditional physical films, LDI technology directly transfers patterns via laser beams, with circuit changes taking only tens of seconds (compared to over 5 hours of cumulative downtime for traditional films, which require 30-40 sets to be replaced every 20 hours). It achieves a minimum line width/space of 3/3 MIL (approximately 75μm), and precise control of process parameters prevents dry film residue in holes. LDI has become a standard configuration for high-end PCBs. In laser drilling technology, UV lasers simplify via processing, while CO₂lasers are suitable for resin materials. Equipped with automatic calibration functions, these technologies ensure mass production precision.

ALIVH Technology Usher in a New Paradigm of Interconnection

Centered on "electroplating-free interconnection," ALIVH technology adopts special substrate materials, high-speed laser drilling machines (20 times more efficient than mechanical drilling), and conductive adhesive filling processes to achieve any-layer interconnection. Its interconnection density is 30%-50% higher than traditional HDI, with interlayer connection resistance less than 1mΩ. It is widely used in mobile phones, automotive electronics, and other fields.

Future Focus: Technological Integration and Green Development

Driven by AI, the HDI board market is expected to achieve a compound annual growth rate (CAGR) of 6.4% from 2024 to 2029, while the growth rate of multi-layer boards with 18 or more layers will reach 15.7%. The integration of laser imaging and ALIVH technology will support emerging fields such as 6G and low-altitude economy. In terms of environmental protection, the coverage rate of lead-free processes has reached 95%, and ALIVH technology reduces electroplating processes and water consumption, promoting the industry's transformation towards "high-endization, greenization, and intelligence." Over the next five years, PCB technology will make breakthroughs in "line width/space below 1μm" and the application of new materials.