The through-hole reflow soldering process is becoming anincreasingly valuable technique in modern electronics manufacturing, especiallyfor mixed-technology PCB assemblies. Unlike traditional wave soldering,through-hole reflow enables selective soldering of through-hole componentsusing the same reflow oven used for surface-mount devices (SMDs), reducingprocess complexity and improving efficiency.

Critical to this process arefactors such as proper thermal profiling, accurate solder paste deposition, andcomponent compatibility with reflow temperatures. Designers must ensureoptimized hole sizes, appropriate lead lengths, and effective solder pastevolume to achieve strong, reliable solder joints.

Our company, with over 22years of experience in high-quality PCBA manufacturing, is actively applyingthrough-hole reflow soldering in both our China and Malaysia facilities. Ournew factory in Penang, Malaysia, began sample trial production in late April2025 and is equipped with advanced SMT and reflow soldering lines. The Penangplant was specifically designed to serve high-reliability markets such asindustrial controls, medical devices, and automotive electronics.

By adopting through-holereflow technology, our Malaysian site enhances production consistency, reducesmanual labor, and supports more compact, complex PCB designs. Our engineeringteam works closely with clients on DFM (Design for Manufacturability) to ensureevery board is optimized for this hybrid soldering process.

As Southeast Asia strengthens its role in global electronicsmanufacturing, our expansion in Malaysia—and adoption of innovative techniqueslike through-hole reflow—underscores our commitment to quality, flexibility,and long-term customer success.