Overcome the challenge of multi-connector group alignment between PCB boards
While improving reliability and reducing costs, printed circuit board (PCB) manufacturers are also facing major pressures such as increasing density, reducing footprint, reducing side dimensions, managing heat flow, and increasing data rates. As they continue to successfully reduce these pressures, an interesting challenge appears to the designers, that is, to align multiple mated connector sets between two PCB boards.




What we need are clear guidelines to understand how to deal with these alignment challenges without sacrificing system performance, density, and reliability, while meeting increasingly stringent budget and time-to-market requirements.
Before describing the conflicting requirements that may be encountered between advanced PCBs and more reliable high-density connectors, this article will discuss the alignment challenges in more detail so that these requirements can be efficiently met through the use of design best practices. Miniaturization makes connector alignment difficult




PCB boards have many directions that can be improved, including density, higher data rates, thermal management, and reliability. However, these improvements are accompanied by the pressure that the trend of miniaturization has brought to designers in the selection and implementation of connectors, especially the pairing of multiple connectors to the PCB board.In terms of connectors, in the past 25 In the middle of the year, miniaturization caused the pitch to drop from 0.100 inches 
 to 0016 inches 


 which is a six-fold reduction, so tighter tolerances are required. However, tighter tolerances are not a problem in themselves. The problem lies in the variability around the nominal tolerance: if multiple connectors change to any of the nominal limits, some problems are more likely to occur.