The silver immersionprocess is between OSP and electroless nickel plating / gold immersion, which is simple and fast. Silver immersion is not to put thickarmor on PCB. Even if exposed to hot, wet and polluted environment, it canstill provide good electrical performance and maintain good solderability, butit will lose luster. Because there is no nickel under the silver layer, silverimmersion does not have all the good physical strength of electroless nickelplating / gold immersion.

Silver immersion is a displacementreaction, which is almost submicron pure silver coating. Sometimes the silverleaching process also contains some organic matter, mainly to prevent silvercorrosion and eliminate the problem of silver migration. Generally, it isdifficult to measure the organic matter in this thin layer. The analysis showsthat the weight of the organism is less than 1%.