<span lang="EN-US" style="font-family:"Times New Roman",serif">Organiccoating OSP

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<span lang="EN-US" style="font-family:"Times New Roman",serif">OSPis different from other surface treatment processes in that it acts as abarrier between copper and air; In short, OSP is to grow a layer of organicfilm on the clean bare copper surface by chemical method. The film has theproperties of anti-oxidation, heat shock resistance and moisture resistance, soas to protect the copper surface from further rusting (oxidation orvulcanization, etc.) in normal environment; At the same time, it must be easyto be quickly removed by flux in the subsequent soldering high temperature forsoldering.

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<span lang="EN-US" style="font-family:"Times New Roman",serif">Organiccoating is widely used in industry because of its simple process and low cost.The early organic coating molecules are imidazole and benzotriazole, and thelatest one is benzimidazole. In order to ensure multiple reflow soldering, onlyone layer of organic coating on the copper surface is not enough, there must bemany layers, which is why the chemical bath usually needs to add liquid copper.After coating the first layer, the coating layer adsorbs copper; Then, the organiccoating molecules in the second layer are combined with copper until theorganic coating molecules are aggregated on the copper surface for 20 or even100 times.

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<span lang="EN-US" style="font-family:"Times New Roman",serif">The general process is as follows:degreasing;micro etching;pickling;pure water cleaning;organic coating;cleaning.Comparedwith other processes, the process control is easier.

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