<span lang="EN-US" style=""font-size:12.0pt;font-family:"Times New Roman",serif;">Reflowsoldering is to solder components to PCB, and reflow soldering is to attachcomponents to the surface. Reflow welding relies on the effect of hot air flowon solder joints, and colloidal flux reacts physically under a certain hightemperature air flow to achieve SMD welding; The reason why it is called"reflow soldering" is that the gas circulates in the welder togenerate high temperature to achieve the welding purpose.

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<span lang="EN-US" style=""font-size:12.0pt;font-family:"Times New Roman",serif;">WhenPCB enters the heating zone, the solvent and gas in the solder paste evaporate.At the same time, the soldering flux in the solder paste wets the pads,component ends and pins, and the solder paste softens, collapses and covers thepads, isolating the pads and component pins from oxygen.

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<span lang="EN-US" style=""font-size:12.0pt;font-family:"Times New Roman",serif;">Whenthe PCB enters the heat preservation zone, the PCB and components are fullypreheated to prevent the PCB from suddenly entering the welding hightemperature zone and damaging the PCB and components.

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<span lang="EN-US" style=""font-size:12.0pt;font-family:"Times New Roman",serif;">WhenPCB enters the soldering area, the temperature rises rapidly to make the solderpaste melt, and the liquid solder wets, diffuses, overflows or reflows thepads, component ends and pins of PCB to form solder joints.

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<span lang="EN-US" style=""font-size:12.0pt;font-family:"Times New Roman",serif;">Whenthe PCB enters the cooling area, the solder joints are solidified; The reflowsoldering is completed.