1. PCB size

The width of the PCB (including the edge ofthe board) must be greater than 50mm and less than 460mm, and the length of thePCB (including the edge of the board) must be greater than 50mm. If the size istoo small, it needs to be made into a jigsaw.

2. PCB board edge width

Board edge width: >5mm, panel spacing:<8mm, distance between pad and board edge: >5mm

3. PCB bending

Upward bending degree: <1.2mm, downwardbending degree: <0.5mm, PCB distortion: maximum deformation height ÷diagonal length <0.25

4. PCB board mark point

Mark shape: standard circle, square,triangle;

Mark size; 0.8~1.5mm;

Mark material: gold-plated, tin-plated,copper and platinum;

Mark's surface requirements: the surface isflat, smooth, non-oxidized, and free of dirt;

Mark's surrounding requirements: thereshould be no green oil or other obstacles within 1mm around, which is obviouslydifferent from the Mark's color;

 Mark position: 3mm or more from the edge ofthe board, and there can be no Mark-like vias, test points, etc. within 5mmaround

5. PCB pads

There are no through holes on the pads ofSMD components. If there is a through hole, the solder paste will flow into thehole, resulting in less tin in the device, or the tin flowing to the otherside, causing the board surface to be uneven and the solder paste cannot beprinted.

When conducting PCB design and production,it is necessary to understand some knowledge of PCBA welding process, so as tomake the product suitable for production, help to improve the welding yield andreduce the cost of production.