Thequality of solder joint in PCBA processing is the most important. Thereliability of solder joint quality determines the reliability and service lifeof PCBA products. Once the solder joint fails, the PCBA will be repaired orscrapped. Improving the reliability of solder joint is one of the machiningobjectives of electronic processing plant. What are the causes of solder jointfailure and how to improve the reliability? The following professional PCBAfactory pate technology to give you a brief introduction.

1<span style=""font-size:14.0pt;font-family:宋体;mso-ascii-font-family:"Times New Roman";">、 Causes of solderjoint failure:

Themain causes of solder joint failure are as follows:

1.Poor pin of components: coating, pollution, oxidation, coplanar;

2.Bad PCB pad: coating, pollution, oxidation, warpage;

3.Solder quality defects: composition, impurities exceeding the standard,oxidation;

4.Flux quality defects: low flux, high corrosion and low sir;

5.Defects in process parameter control: design, control and equipment;

6.Other auxiliary material defects: adhesive, cleaning agent.

2<span style=""font-size:14.0pt;font-family:宋体;mso-ascii-font-family:"Times New Roman";">、 Reliabilityimprovement method:

1.The main purpose is to analyze and identify the reliability of PCBA solderjoints and provide reference parameters for machining;

2.In order to improve the reliability of solder joints in the process ofprocessing, the failure solder joints are carefully analyzed and the causes offailure are found out. Then the process improvement is carried out to graduallysolve the solder joint failure problem.