According to the upstream and downstream of the industrial chain, it can be divided into raw materials, copper-clad boards, printed circuit boards, and electronic product applications, etc. The relationship is simple as follows:

Fiberglass cloth: fiberglass cloth is one of the raw materials of copper-clad sheets. It is woven from fiberglass yarn and accounts for approximately 40% (thick) or 25% (thin) of the cost of copper-clad sheets. The glass fiber yarn is calcined into liquid form by silica sand and other raw materials in the kiln. The glass fiber is pulled into a very fine glass fiber by a very fine alloy nozzle, and then hundreds of glass fibers are twisted into glass fiber yarn. The construction investment of the kiln is huge, which generally needs hundreds of millions of capital, and once the ignition must be 24 hours of uninterrupted production, the entry and exit costs are huge.

Copper foil: copper foil is the raw material accounting for the largest proportion of the cost of copper cladding, accounting for about 30% (thick plate) or 50% (thin plate) of the cost of copper cladding. Therefore, the price rise of copper is the main driving force for the price rise of copper cladding.

Copper-clad board: copper-clad board is the product of glass fiber cloth and copper foil pressed together with epoxy resin as the fusion agent. It is the direct raw material of printed circuit board. After etching, electroplating and lamination, it is made into printed circuit board.