With the continuous development of SMT electroniccomponents towards miniaturization, chip integration is getting higher andhigher. Whether it is notebook, smart phone, medical equipment, automobileelectronics, military and aerospace products, array packaging BGA, CSP andother devices in the products are more and more applied, and the qualityrequirements of the products are also increasing.

5G is a hot word in 2019, but now the 5G era hasbegun. From the perspective of the PCBA circuit board of mobile phones,compared with 4G mobile phones, the design difficulties of 5G mobile phones aremainly focused on rf and antenna, in addition to baseband chips. Because 5G isat least 1 times higher than 4G frequency, 5 times wider than 4G frequencyband, up to 29 frequency bands, 5 times higher than 4G power, 10 times higherthan 4G speed, and dozens of times more antennas. This requires us toconstantly improve the process capacity, increase high-end equipment, throughhigh quality welding to ensure high reliability of products.

Analysis of various processes for PCBA highly reliablewelding 

In the high-precision electronic manufacturingprocess, there are many SMT production equipment, the main automation equipmentis SMT automatic X-ray spot machine, SMT first piece detector, automatic solderpaste printing machine, online 3D-SPI solder paste printing detector, SMTplacement machine, reflow welding, online AOI optical detector, online PCBAautomatic milling cutter board machine and so on.