1.Optimizing the Customer's BOM List
    The specific method is to replace the outdated components with new components as much as possible. These new replacements are more suitable and stable than the original components in terms of size, structure and function. Furthermore, the production design can be optimized through a DFM (manufacture ability design) process, and the DFT (Test Design) can be used to expand the test range to verify that the operations performed by it can maximize the customer's needs. In addition, the digital work instructions can be edited, the precise temperature profile ensures that the reflow oven is operating normally, and the PCBA processing aid can be used to standardize the correct specifications for the product at the first time.
2.Carrying Out Strict Inspection of Incoming Material
   The goal is to deactivate all unqualified materials at all stages. Material consistency will be revalidated when the kit is picked up and when the PCBA product is placed on the desired feeder and ready for chip placement (strip). 2D barcodes are used to identify custom PCB (unfilled printed circuit boards) for a variety of tracking purposes. Finally, paperless office and production have advantages.
3.Installing Online 3D Solder Paste Inspection Station
   BQC recommends that an online 3D solder paste inspection (SPI) station should be installed on each SMT line to check if each solder is 100% deposited and verify whether they produce the correct IPC610 solder joint. This greatly increases the first pass rate when building complex PCBA. Considering that a high ratio of solder error problems is often found after the solder reflow process (the underlying cause is the misuse of solder paste), it is easy to prove that the investment made in these stations is worthwhile.
4.Installing Online Color Automatic Optical Inspection
  Online Color Automated Optical Inspection (AOI) is also installed on each SMT line in the MC assembly. Golden PCBA is used to train these automated checkpoints to verify that their components are properly placed, soldered, and aligned. Offline 3DX ray and 3DAOI tools are used to detect possible defects such as incomplete BGA solder ball collapse and pillow-type tomb stoning effects, which will be missed by the standard color AOI.


Shenzhen Baiqiancheng Electronic Co. Ltd, the old electronic processing factory, can provide you with high-quality SMT chip processing services, as well as a wealth of PCBA processing experience. BQC can also undertake DIP plug-in processing and PCB production, electronic circuit board manufacturing services.